Technology / Process
Ultra-high efficiency from EpiNex®
From Gas to Wafer. A Smarter Manufacturing Process.
Five steps transform silicon feedstock into precision-engineered wafers, eliminating conventional ingot growth and wire sawing.
Step 1
Seed Preparation
The first step in our patented process is creation of a precisely engineered silicon release layer on the seed wafer substrate with scalability to mass production.
Step 2
Epitaxial Growth
The heart of the EpiNex® process is the high throughput in-line CVD direct ‘gas to wafer’ deposition process. This enables >40% less energy consumption than conventional CZ and wafering and significantly less waste.
Step 3
Wafer Detachment
The EpiNex® wafer is detached from the seed wafer substrate and the seed wafer recycled for continued use.
Step 4
Wafer Finishing
The EpiNex® wafer undergoes a final post treatment and is ready for packaging.
Step 5
Finished EpiNex® Wafer
The finished wafer offers the highest level of quality and repeatability and is a drop in replacement for conventional CZ wafers.
The NexWafe way
EpiNex® technology reduces waste in wafer manufacturing by almost 50%
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